| TYPE | DESCRIPTION |
| Mfr | Aries Electronics, Inc. |
| Series | 55 |
| Package | Bulk |
| Product Status | ACTIVE |
| Features | Closed Frame |
| Mounting Type | Through Hole |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Operating Temperature | -65°C ~ 105°C |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 200.0µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) |
| Contact Material - Post | Beryllium Copper |
| Termination Post Length | 0.110" (2.78mm) |
| Current Rating (Amps) | 1 A |
Shenzhen JIQUN Technology Co., Ltd
Room 906, Baoneng Automobile Building, Sungang Street, Luohu District, Shenzhen, Guangdong Province
1968195384@qq.com
86-13826519287
