| TYPE | DESCRIPTION |
| Mfr | Aries Electronics, Inc. |
| Series | Lo-PRO®file, 526 |
| Package | Bulk |
| Product Status | ACTIVE |
| Features | Closed Frame |
| Mounting Type | Through Hole |
| Type | DIP, ZIF (ZIP) |
| Operating Temperature | -55°C ~ 105°C |
| Number of Positions or Pins (Grid) | 40 (2 x 20) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Material - Post | Beryllium Copper |
| Termination Post Length | 0.105" (2.67mm) |
| Current Rating (Amps) | 3 A |
Shenzhen JIQUN Technology Co., Ltd
Room 906, Baoneng Automobile Building, Sungang Street, Luohu District, Shenzhen, Guangdong Province
1968195384@qq.com
86-13826519287
