44-6552-16
44-6552-16
Part number:
44-6552-16-ND
Product_Category
IC Sockets
Manufacturer
Aries Electronics, Inc.
Type
CONN IC DIP SOC
Encapsulation
Package
Bulk
RoHS:
NO
Quantity
200
$6.3128
Minimun: 1
multiples: 1
Quantity
Price
Total
7
$6.3128
$44.1896
44-6552-16 NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrAries Electronics, Inc.
Series55
PackageBulk
Product StatusACTIVE
FeaturesClosed Frame
Mounting TypeThrough Hole
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)44 (2 x 22)
TerminationSolder
Material Flammability RatingUL94 V-0
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingNickel Boron
Contact Finish Thickness - Mating50.0µin (1.27µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostNickel Boron
Contact Finish Thickness - Post50.0µin (1.27µm)
Contact Material - PostBeryllium Copper
Termination Post Length0.110" (2.78mm)
Current Rating (Amps)1 A
86-13826519287‬