SMDIN66.3BI33.7
SMDIN66.3BI33.7
Part number:
315-SMDIN66.3BI33.7-ND
Product_Category
Solder
Manufacturer
Chip Quik, Inc.
Type
INDIUM/BISMUTH
Encapsulation
Package
Bulk
RoHS:
NO
Quantity
241
$2.3960
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$2.3960
$2.3960
SMDIN66.3BI33.7 NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesCHIPQUIK®
PackageBulk
Product StatusACTIVE
Diameter0.031" (0.79mm)
CompositionIn66.3Bi33.7 (66.3/33.7)
TypeWire Solder
Melting Point162°F (72°C)
FormSpool
ProcessLead Free
Shelf Life StartDate of Manufacture
Shelf Life60 Months
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